Intel is poised to revolutionize chipmaking with PowerVia, a groundbreaking approach to delivering power to chips. Traditionally, chips have been constructed layer by layer, with power wires on the top. However, this approach is causing problems as chips become smaller and denser, leading to performance issues.
Intel’s solution is “backside power,” a method to move power wires to the backside of the chip, leaving the front side focused solely on interconnection. This approach simplifies manufacturing and improves chip performance.
PowerVia flips the traditional chipmaking process. Transistors are built first, followed by interconnect layers. The wafer is then flipped, and the bottom layer is exposed for power wire connections. This direct path enhances power delivery to transistors.
The benefits are manifold. Power wires on the front side can take up to 20% of real estate, but PowerVia eliminates this. The manufacturing process is cost-effective, simplifying chip production.
A test chip called Blue Sky Creek showed remarkable improvements. PowerVia enhanced power delivery and signal wiring, resulting in better speed and efficiency. This is a significant step forward, adhering to Moore’s Law.
Debugging was a challenge with transistors sandwiched in the middle of the chip. However, the team made significant progress in developing debug capabilities.
PowerVia will be introduced in the Intel 20A node in 2024, putting competitors two years behind in backside power. The first product using PowerVia will be Arrow Lake, a next-generation Intel processor for PCs, offering improved efficiency and performance.
Intel’s PowerVia is set to reshape chipmaking, offering a competitive edge and improved efficiency for future processors.