Emphasizing its commitment to technology innovation and global growth, Intel Corporation has signed groundbreaking contracts to build semiconductor fabs in Germany, Israel and Poland. The investments in Germany will total US$33 billion, Israel US$25 billion and Poland US$5 billion. Intel’s strategic entry into these countries heralds a new era of semiconductor manufacturing.
The agreement in Germany paves the way for Intel to build an advanced facility near Magdeburg that includes at least two fabs. These facilities will exceed initial plans for chip production and will utilize more advanced technology. While Intel is not disclosing the specific manufacturing technology, it reports that the technology will be from the angstrom era and will have an impressive 18 to 20A scale.
A €10 billion government subsidy has been secured to support this ambitious project, which must be approved by the European Union. The stimulus package not only reflects Intel and the German government’s commitment to strengthening European semiconductor supremacy, but also serves as a catalyst for regional economic growth. The first plant should be operational within the next 4-5 years, setting the stage for revolutionary advances in chip manufacturing.
At the same time, Poland is looking forward to the start of a major €4.6 billion project that will see the construction of a semiconductor assembly and testing plant in Wroclaw. This facility, although less expensive, is no less significant. The Wroclaw plant is scheduled for completion in 2027 and will employ 2,000 people and play a key role in the development of technological progress in Poland. Design and planning for the project will begin immediately, and construction will begin upon authorization from the European Commission.
Intel’s European endeavors fit seamlessly with its global strategy to strengthen infrastructure on the continent. This collaborative effort coincides with the European Union’s ambitious plans to become a formidable “semiconductor superpower” and reduce its reliance on externally sourced critical electronic components. In line with this vision, Intel has announced plans to establish a research, development and design center in France, as well as lithography and end-production facilities in countries such as Ireland, Italy, Poland, Spain and others.
In addition, Intel’s intention to expand its plant in Kiryat Gat, Israel, has further strengthened its position as a key player in the global semiconductor industry. Prime Minister Benjamin Netanyahu announced that Intel intends to invest an impressive $25 billion in the construction of the new plant. The facility, which will begin operations in 2027, is expected to create thousands of jobs and will have a significant impact on Israel’s economy. As part of the agreement, Intel’s tax rate will be raised from the current 5% to 7.5%, signaling the Israeli government’s support for this ambitious endeavor.
Intel’s bold expansion plans in Germany, Israel, Poland and other European countries demonstrate its continued commitment to technological advancement and recognizes the European Union’s desire for semiconductor dominance. With these investments, Intel intends to transform the future of chip manufacturing, drive economic growth and strengthen Europe’s position as a technology powerhouse. A new era of innovation is dawning as Intel leads the semiconductor revolution in Europe.